MR18R162GAF0-CK8 SPC, CIRCUIT, FUNCTION
MR18R162GAF0-CK8 Datasheet PDF
| Tagagawa | Packing | Paglalarawan | Temperatura | |
|---|---|---|---|---|
| Samsung semiconductor | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V | Min°C | Max°C |
- Samsung semiconductor MR18R162GAF0
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die - Samsung semiconductor MR18R162GAF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V - Samsung semiconductor MR18R162GAF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR18R162GAF0-CN9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR18R162GAF0-CT9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V